Wafer pod gas charging apparatus

ABSTRACT

A wafer pod gas charging apparatus includes a machine, on which different types of nozzles are introduced. One type of the nozzles is designed to have an inner tube elastically movable in an outer sleeve. When a wafer pod having gas ports of a specific depth is placed on the machine for charging gas, the exact type of the wafer pod can be detected by a sensor unit on the machine and the gas ports of the wafer pod can properly engage with one matching type of the nozzles on the machine to enable the gas charging. Therefore, by changing the structural designs of the nozzles on the machine, the same one machine is adapted to charge gas into different types of wafer pods at reduced cost.

FIELD OF THE INVENTION

The present invention relates to a wafer pod gas charging apparatus, and more particularly to a wafer pod gas charging apparatus that is adapted to charge gas into different types of wafer pods at reduced cost.

BACKGROUND OF THE INVENTION

In general semiconductor processing, there are times wafers are placed in a wafer pod according to actual need in the processing, and a type of gas, such as nitrogen, is charged into the wafer pod to protect the wafers in the wafer pod against corrosion or contamination.

Conventionally, the wafer pod is provided with gas ports, via which the nitrogen is charged into the wafer pod. However, currently, there are at least two types of wafer pods available in the market. These two types of wafer pods are different in the number of their gas ports. For example, one type of these wafer pods has two gas ports while the other type has four gas ports. Further, these two types of wafer pods are different in the locations of their gas ports. Therefore, at least two different machines are required for charging gas into different types of wafer pods.

Since each type of wafer pod requires a specific type of machine for gas charging, the machines for charging gas into different wafer pods are not exchangeable in use. As a result, increased costs for gas charging machines are undesirably needed.

It is therefore desirable to have a wafer pod gas charging apparatus that can be used with different types of wafer pods to save the costs for different gas charging machines.

SUMMARY OF THE INVENTION

In view of the disadvantage in the conventional non-exchangeable wafer pod gas charging machines, the inventor has developed an improved wafer pod gas charging apparatus adapted to charge gas into different types of wafer pods to save costs for different machines.

A primary object of the present invention is to provide a wafer pod gas charging apparatus including a machine, which is provided with structurally changed nozzles and is therefore adaptable to charge gas into different types of wafer pods to save the costs for different gas charging machines.

To achieve the above and other objects, the wafer pod gas charging apparatus according to the present invention includes a machine, a sensor unit, at least two first nozzles, at least two second nozzles, at least three locating modules, a gas charger, and a controller.

The machine includes an operating plate for carrying a wafer pod thereon. The wafer pod includes a bottom, on which a specific zone, at least two gas ports, and at least three locating holes are provided.

The operating plate is in contact with the bottom of the wafer pod placed thereon. The sensor unit, the first nozzles, the second nozzles, and the locating modules all are mounted on the operating plate of the machine. The sensor unit is mounted on the operating plate at a position corresponding to the specific zone on the bottom of the wafer pod. Each of the second nozzles includes an inner tube, an outer sleeve, and an elastic element. The elastic element is fitted in the outer sleeve, and the inner tube is received in the outer sleeve to press against the elastic element, such that the inner tube is axially movable in the outer sleeve due to the elasticity of the elastic element. Each of the locating modules includes a locating pin, and the locating pins of the locating modules are correspondingly inserted into the locating holes on the bottom of the wafer pod.

The gas charger is arranged on the machine for containing a type of gas therein. The gas charger communicates with the at least two first nozzles and the at least two second nozzles, and includes a control unit.

The controller is arranged on the machine to electrically connect to the control unit of the gas charger and the sensor unit. Either the at least two first nozzles or the at least two second nozzles are correspondingly connected to the at least two gas ports on the wafer pod.

When the wafer pod gas charging apparatus of the present invention is in use, the sensor unit is aligned with the specific zone on the wafer pod to detect the type of the wafer pod currently placed on the operating plate of the machine. The controller is operated to control the gas charger to charge the gas into the wafer pod via the first nozzles or the second nozzles, depending on the detected wafer pod type, and the gas ports on the wafer pod that are correspondingly connected to the first or the second nozzles. Since wafer pods of different types have nozzles of different depths, the second nozzles are designed to respectively have an inner tube elastically axially movable in the outer sleeve to adapt to the deeper gas ports on the wafer pod.

Therefore, by changing the structural design of the nozzles on the machine, the same one machine is adapted to charge gas into different types of wafer pods to save the costs for different gas charging machines.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein

FIG. 1 is a perspective view of a general wafer pod;

FIG. 2 is a bottom view of a first type of currently available wafer pod;

FIG. 3 is a bottom view of a second type of currently available wafer pod;

FIG. 4 is an exploded perspective view of a wafer pod gas charging apparatus according to a preferred embodiment of the present invention;

FIG. 5 is an assembled view of FIG. 4;

FIG. 6 is an exploded perspective view of a first nozzle for the wafer pod gas charging apparatus according to the preferred embodiment of the present invention;

FIG. 7 is an assembled view of FIG. 6;

FIG. 8 is a longitudinal sectional view of FIG. 7;

FIG. 9 is an exploded perspective view of a second nozzle for the wafer pod gas charging apparatus according to the preferred embodiment of the present invention;

FIG. 10 is an assembled view of FIG. 9;

FIG. 11 is a longitudinal sectional view of FIG. 10; and

FIG. 12 shows the movement of the second nozzle.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with a preferred embodiment thereof and with reference to the accompanying drawings.

FIG. 1 is a top perspective view of a general wafer pod 9 used in semiconductor processing.

Please refer to FIGS. 1, 2 and 3 at the same time, wherein FIG. 2 is a bottom view of a first type of currently available wafer pod 901 and FIG. 3 is a bottom view of a second type of currently available wafer pod 902. The wafer pod 9 shown in FIG. 1 may be the first-type wafer pod 901 or the second-type wafer pod 902.

As can be seen in FIG. 2, the first-type wafer pod 901 includes a bottom 90, on which there are provided a specific zone 91, four gas ports 92 and three locating holes 93. The specific zone 91 on the first-type wafer pod 901 is a virtual zone with respect to the second-type wafer pod 902, and will be described in more details below. The four gas ports 92 are divided into gas inlet ports and gas outlet ports. In practical use thereof, the four gas ports 92 are provided in pairs.

As can be seen in FIG. 3, the second-type wafer pod 902 also includes a bottom 95, on which there are also provided a specific zone 96, two gas ports 97 and three locating holes 98. The specific zone 96 on the second-type wafer pod 902 is provided with a recess 961. Therefore, the bottom 95 of the second-type wafer pod 902 is different from the bottom 90 of the first-type wafer pod 901 in having the recess 961 at the specific zone 96. The two gas ports 97 include a gas inlet port and a gas outlet port. In the illustrated examples of the wafer pods 901 and 902, the two gas ports 97 on the second-type wafer pod 902 have a depth larger than that of the four gas ports 92 on the first-type wafer pod 901.

Please refer to FIG. 4 that is an exploded perspective view of a wafer pod gas charging apparatus according to a preferred embodiment of the present invention. As shown, the wafer pod gas charging apparatus includes a machine 2, a sensor unit 8, four first nozzles 3, two second nozzles 4, three locating modules 5, a gas charger 6, and a controller 7.

The machine 2 includes an operating plate 21, on which the sensor unit 8, the first nozzles 4, the second nozzles 4 and the locating modules 5 are mounted. The gas charger 6 and the controller 7 are mounted on the machine 2.

In the illustrated preferred embodiment of the present invention, the sensor unit 8 includes a light sensor 81 and a pushbutton-type optical sensor 82; and each of the three locating modules 5 includes a locating pin 51 and a pushbutton-type optical sensor 52 arranged in the vicinity of the locating pin 51.

It is noted the pushbutton-type optical sensor referred to herein includes a protruded portion that moves upward or downward under an external force applied thereto to block the light sensing function in the optical sensor and thereby achieve the effect of turning on/off an electric circuit and accomplish the sensing purpose. Since the above-mentioned structural principle of the pushbutton-type optical sensor is known by one of ordinary skill in the art, it is not repeatedly discussed herein.

All the above-mentioned parts are assembled or mounted to the operating plate 21 or the machine 2 using screws, and FIG. 5 is a perspective view showing the machine 2 and other parts of FIG. 4 in an assembled state.

FIGS. 6 and 7 are exploded and assembled perspective views, respectively, of a first nozzle 3 for the wafer pod gas charging apparatus according to the preferred embodiment of the present invention, and FIG. 8 is a longitudinal cross-sectional view of the first nozzle 3. Please refer to FIG. 4 along with FIGS. 6 to 8. The first nozzles 3 are mounted to predetermined positions on the operating plate 21 of the machine 2. Each of the first nozzles 3 has a first gas outlet 31 and a first gas inlet 32, and includes a rubber ring member 311 connected to a top of the first gas outlet 31.

FIGS. 9 and 10 are exploded and assembled perspective views, respectively, of a second nozzle 4 for the wafer pod gas charging apparatus according to the preferred embodiment of the present invention, and FIG. 11 is a longitudinal cross-sectional view of the second nozzle 4. Please refer to FIG. 4 along with FIGS. 9 to 11. The second nozzles 4 are mounted to predetermined positions on the operating plate 21 of the machine 2. Each of the second nozzles 4 includes an inner tube 43, an outer sleeve 44, and an elastic element 45. In the illustrated preferred embodiment, the elastic element 45 is a spring fitted in the outer sleeve 44, and the inner tube 43 is received in the outer sleeve 44 to press against the elastic element 45, such that the inner tube 43 is axially movable in the outer sleeve 44 due to the elasticity of the elastic element 45. The inner tube 43 has a second gas outlet 41 and a second gas inlet 42. Each of the second nozzles 4 further includes a rubber ring member 411 connected to a top of the second gas outlet 41 of the inner tube 43, and a nut 46 externally screwed to the second gas inlet 42 of the inner tube 43.

Please refer to FIGS. 4 and 5 again. In view that the gas ports 97 on the second-type wafer pod 902 (see FIG. 3) are deeper than the gas ports 92 on the first-type wafer pod 901 (see FIG. 2), the second nozzles 4 are designed to be higher than the first nozzles 3 by a predetermined distance after they are mounted on the operating plate 21.

The gas charger 6 arranged on the machine 2 internally contains a type of gas 62. In the illustrated preferred embodiment, the gas 62 is nitrogen. The gas charger 6 communicates with the first nozzles 3 and the second nozzles 4, and includes a control unit 61. The control unit 61 includes a gas pressure sensor 611.

The controller 7 arranged on the machine 2 is electrically connected to the control unit 61 of the gas charger 6, the light sensor 81 and the pushbutton-type optical sensor 82 of the sensor unit 8, and the pushbutton-type optical sensors 52 of the locating modules 5.

Please refer to FIGS. 2, 4, 5, 7 and 8 at the same time. To charge gas into the first-type wafer pod 901, first place the first-type wafer pod 901 on the operating plate 21 of the machine 2. That is, the operating plate 21 carries the first-type wafer pod 901 and is in contact with the bottom 90. At this point, the sensor unit 8 is aligned with the specific zone 91 on the bottom 90 of the first-type wafer pod 901, the locating pins 51 of the locating modules 5 are correspondingly inserted into the locating holes 93 on the bottom 90 of the first-type wafer pod 901, and the pushbutton-type optical sensors 52 of the locating modules 5 are correspondingly pressed against the bottom 90 of the first-type wafer pod 901.

Since the specific zone 91 on the bottom 90 does not have any recess formed thereat, the bottom 90 will apply a downward force against the pushbutton-type optical sensor 82 of the sensor unit 8 once the first-type wafer pod 901 is placed on the operating plate 21 of the machine 2. The pushbutton-type optical sensor 82 under the force applied by the bottom 90 of the first-type wafer pod 901 will for example displace and its internal light sensing is interrupted. With this sensing function, the machine 2 can detect that the wafer pod currently placed on the operating plate 21 is a first-type wafer pod 901. Further, since the specific zone 91 on the bottom 90 of the first-type wafer pod 901 does not have any recess formed thereat, the bottom 90 of the first-type wafer pod 901 placed on the operating plate 21 is relatively close to the light sensor 81 of the sensor unit 8. That is, a distance between the light sensor 81 of the sensor unit 8 and the bottom 90 is relatively smaller. Therefore, it is also possible to detect the wafer pod placed on the operating plate 21 is a first-type wafer pod 901 by detecting the smaller distance between the light sensor 81 and the bottom 90 with light. By simultaneously using the light sensor 81 and the pushbutton-type optical sensor 82 to perform the sensing function, a double-check effect can be obtained.

After the first-type wafer pod 901 is placed on the operating plate 21, the gas ports 92 are correspondingly aligned with the first nozzles 3 while the second nozzles 4 higher than the first nozzles 3 by a predetermined distance are in contact with the bottom 90 of the first-type wafer pod 901. With the elastic element 45 fitted in each of the second nozzles 4, as shown in FIG. 11, the protruded second nozzles 4 can be elastically moved downward by a distance under the weight of the first-type wafer pod 901, as shown in FIG. 12.

With the first-type wafer pod 901 placed on the operating plate 21 of the machine 2, the controller 7 can be operated to control the gas charger 6 to charge the gas 62 into the first-type wafer pod 901 via the first nozzles 3 and the gas ports 92. More specifically, the gas 62 enters the first nozzles 3 via the first gas inlets 32 and then leaves the first nozzles 3 via the first gas outlets 31 into the gas ports 92 and the first-type wafer pod 901. In the process of gas charging, the rubber ring members 311 connected to the top of the gas outlets 31 of the first nozzles 3 are tightly engaged with the gas ports 92 of the first-type wafer pod 901 to prevent gas leaking thereat.

Please refer to FIGS. 3, 4, 5 and 9 to 12 at the same time. To charge gas into the second-type wafer pod 902, first place the second-type wafer pod 902 on the operating plate 21 of the machine 2. That is, the operating plate 21 carries the second-type wafer pod 902 and is in contact with the bottom 95. At this point, the sensor unit 8 is aligned with the specific zone 96 on the bottom 95 of the second-type wafer pod 902, the locating pins 51 of the locating modules 5 are correspondingly inserted into the locating holes 98 on the bottom 95 of the second-type wafer pod 902, and the pushbutton-type optical sensors 52 of the locating modules 5 are correspondingly pressed against the bottom 95 of the second-type wafer pod 902.

Since the specific zone 96 on the bottom 95 has a recess 961 formed thereat, the bottom 95 does not apply any downward force against the pushbutton-type optical sensor 82 of the sensor unit 8 once the second-type wafer pod 902 is placed on the operating plate 21 of the machine 2. The pushbutton-type optical sensor 82 not subjected to any force from the bottom 95 of the second-type wafer pod 902 does not displace, for example, and its internal light sensing is not interrupted. With this sensing function, the machine 2 can detect that the wafer pod currently placed on the operating plate 21 is a second-type wafer pod 902. Further, since the specific zone 96 on the bottom 95 of the second-type wafer pod 902 has the recess 961 formed thereat, the recess 961 on the bottom 95 of the second-type wafer pod 902 placed on the operating plate 21 is relatively distant from the light sensor 81 of the sensor unit 8 due to a depth of the recess 961. That is, a distance between the light sensor 81 of the sensor unit 8 and the recess 961 at the specific zone 96 of the bottom 95 is relatively longer. Therefore, it is also possible to detect the wafer pod placed on the operating plate 21 is a second-type wafer pod 902 by detecting the longer distance between the light sensor 81 and the bottom 95 with light. Similarly, by simultaneously using the light sensor 81 and the pushbutton-type optical sensor 82 to perform the sensing function, a double-check effect can be obtained.

After the second-type wafer pod 902 is placed on the operating plate 21, the gas ports 97 are correspondingly aligned with and connected to the second nozzles 4 while the first nozzles 3 lower than the second nozzles 4 by a predetermined distance do not interfere with the second-type wafer pod 902.

With the second-type wafer pod 902 placed on the operating plate 21 of the machine 2, the controller 7 can be operated to control the gas charger 6 to charge the gas 62 into the second-type wafer pod 902 via the second nozzles 4 and the gas ports 97. More specifically, the gas 62 enters the second nozzles 4 via the second gas inlets 42 of the inner tubes 43 and then leaves the second nozzles 4 via the second gas outlets 41 of the inner tubes 43 into the gas ports 97 and the second-type wafer pod 902. In the process of gas charging, the rubber ring members 411 connected to the top of the gas outlets 41 of the second nozzles 4 are tightly engaged with the gas ports 97 of the second-type wafer pod 902 to prevent gas leaking thereat.

As can be seen from FIGS. 1 to 12, the same one machine 2 can be used for charging gas into different types of wafer pods, that is, the first-type and the second-type wafer pod 901, 902. This is because the second nozzles 4 are designed to respectively have an inner tube 43 elastically movable upward and downward in the outer sleeve 44, so that the first nozzles 3 and the second nozzles 4 can correspondingly engage with the gas ports 92 of the first-type wafer pod 901 and the deeper gas ports 97 of the second-type wafer pod 902, respectively. In brief, by changing the structural designs of the first nozzles 3 and the second nozzles 4 on the machine 2, the same one machine 2 is adapted to charge gas into different types of wafer pods 9, i.e. the first-type and the second-type wafer pod 901, 902. With the increased adaptability of the machine 2, a large amount of cost for charging gas into the wafer pods 9 can be saved.

What is to be noted is that the wafer pod gas charging apparatus of the present invention is provided with three locating modules 5, each of which includes a pushbutton-type optical sensor 52. When a wafer pod 9, either the first-type wafer pod 901 or the second-type wafer pod 902, is placed on the operating plate 21 of the machine 2 to correspondingly press against the pushbutton-type optical sensors 52, the same pushbutton-type optical sensors 52 with the above-described sensing function can also be used to detect whether the wafer pod 9, either the first-type wafer pod 901 or the second-type wafer pod 902, is correctly positioned on the operating plate 21 based on the principle that three points define a plane.

Further, the gas pressure sensor 611 included in the control unit 61 of the gas charger 6 serves to detect whether the pressure of the charged gas is in a normal range in the process of gas charging. In the event the detected gas pressure is lower than or higher than a preset range, the gas charger 6 can be immediately turned off in consideration of safety in use.

With the above arrangements, the present invention is novel, improved and industrially valuable. The present invention is novel and improved because it includes a machine provided with structurally changed nozzles, so that the same one machine is adapted to charge gas into different types of wafer pods at reduced cost. The present invention is industrially valuable because products derived from it would no doubt fulfill the current market demands.

The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications in the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims. 

What is claimed is:
 1. A wafer pod gas charging apparatus for using with a wafer pod, the wafer pod including a bottom, on which a specific zone, at least two gas ports and at least three locating holes are provided; the wafer pod gas charging apparatus comprising: a machine having an operating plate for carrying the wafer pod thereon and correspondingly contacting with the bottom of the wafer pod; a sensor unit being mounted on the operating plate of the machine at a position corresponding to the specific zone on the bottom of the wafer pod; at least two first nozzles being mounted on the operating plate of the machine at predetermined positions; at least two second nozzles being mounted on the operating plate of the machine at other predetermined positions; each of the second nozzles including an inner tube, an outer sleeve, and an elastic element; the elastic element being fitted in the outer sleeve, and the inner tube being received in the outer sleeve to press against the elastic element, such that the inner tube is axially movable in the outer sleeve due to the elasticity of the elastic element; at least three locating modules being mounted on the operating plate of the machine; each of the locating modules including a locating pin, and the locating pins of the locating modules being correspondingly inserted into the locating holes on the bottom of the wafer pod; a gas charger being arranged on the machine for containing a type of gas therein; the gas charger communicating with the at least two first nozzles and the at least two second nozzles and including a control unit; and a controller being arranged on the machine to electrically connect to the control unit of the gas charger and the sensor unit; wherein either the at least two first nozzles or the at least two second nozzles are correspondingly connected to the at least two gas ports on the wafer pod.
 2. The wafer pod gas charging apparatus as claimed in claim 1, wherein the sensor unit is a light sensor electrically connected to the controller.
 3. The wafer pod gas charging apparatus as claimed in claim 1, wherein the sensor unit is a pushbutton-type optical sensor electrically connected to the controller.
 4. The wafer pod gas charging apparatus as claimed in claim 1, wherein the specific zone is formed with a recess.
 5. The wafer pod gas charging apparatus as claimed in claim 1, wherein the gas contained in the gas charger is nitrogen.
 6. The wafer pod gas charging apparatus as claimed in claim 1, wherein the control unit of the gas charger includes a gas pressure sensor.
 7. The wafer pod gas charging apparatus as claimed in claim 1, wherein the elastic element in each of the second nozzles is a spring.
 8. The wafer pod gas charging apparatus as claimed in claim 1, wherein each of the first nozzles includes a rubber ring member.
 9. The wafer pod gas charging apparatus as claimed in claim 1, wherein each of the second nozzles includes a rubber ring member.
 10. The wafer pod gas charging apparatus as claimed in claim 1, wherein each of the locating modules includes a pushbutton-type optical sensor correspondingly pressed against the bottom of the wafer pod.
 11. The wafer pod gas charging apparatus as claimed in claim 1, wherein the inner tube of each of the second nozzles has a nut screwed thereto. 